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Toshiba America Electronic Components TMPN3150B1AFG Application Specific MCUs
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TMPN3150B1AFG Tech Specifications
| Category | Embedded - Microcontrollers - Application Specific | |
| Manufacturer | Toshiba | |
| Surface Mount | YES | |
| Number of Terminals | 64Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | 14 X 14 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-64 | |
| Clock Frequency-Max | 10 MHz | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V |
| Supply Voltage-Nom | 5 V | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 64 | |
| JESD-30 Code | S-PQFP-G64 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN | |
| Seated Height-Max | 3.15 mm | |
| Address Bus Width | 16 | |
| Boundary Scan | NO | |
| Low Power Mode | YES | |
| External Data Bus Width | 8 | |
| Number of Serial I/Os | 1Serial I/O | |
| Length | 14 mm | |
| Width | 14 mm |
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TMPN3150B1AFG Documents
Download datasheets and manufacturer documentation for TMPN3150B1AFG
- Datasheets8f35fa33328754894e9c4f3c01f4b4b2.pdf
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