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- TMPZ84C42AP
Toshiba America Electronic Components TMPZ84C42AP Application Specific MCUs
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TMPZ84C42AP Tech Specifications
| Category | Embedded - Microcontrollers - Application Specific | |
| Manufacturer | Toshiba | |
| Surface Mount | NO | |
| Number of Terminals | 40Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Package Description | DIP, DIP40,.6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP40,.6 |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Supply Voltage-Nom | 5 V | |
| JESD-609 Code | e0 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PDIP-T40 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL |
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TMPZ84C42AP Documents
Download datasheets and manufacturer documentation for TMPZ84C42AP
- DatasheetsTOSHS15485-1.pdf
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