TMPM333FYFG(C) Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Toshiba
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 100-LQFP
Data Converters A/D 12x10b
Number of I/Os 78I/Os
Operating Temperature -20°C~85°C TA
Packaging Tray
Series TX03
Published 2010
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Frequency 40MHz
Interface I2C, UART, USART
Memory Size 256kB
Oscillator Type External
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~3.6V
Core Processor ARM® Cortex®-M3
Peripherals POR, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity I2C, SIO, UART/USART
Core Architecture ARM
RoHS Status RoHS Compliant
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