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TMPM36BF10FG(DBB) Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Toshiba
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 100-LQFP
Data Converters A/D 16x12b
Number of I/Os 72I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series TX03
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type External
Speed 64MHz
RAM Size 258K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~3.6V
Core Processor ARM® Cortex®-M3
Peripherals DMA, LVD, POR, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 1MB 1M x 8
Connectivity EBI/EMI, I2C, IrDA, Microwire, SIO, SPI, SSI, SSP, UART/USART
RoHS Status RoHS Compliant
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