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TS128MSQ64V6J Tech Specifications

Category Memory Cards
Manufacturer Transcend
ECCN (US) EAR99
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 512M
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 667
Chip Configuration 64Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
ECC Support No
Number of Ranks SingleRank
CAS Latency 5
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 67.6
PCB changed 200
Lead Shape No Lead
Part Status Active
Pin Count 200
Organization 128Mx64
Self Refresh No
Module Type 200SODIMM
RoHS Status RoHS Compliant
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TS128MSQ64V6J Documents

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