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TS256MSQ64V6U Tech Specifications

Category Memory Cards
Manufacturer Transcend
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 667
Chip Configuration 128Mx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.8
Module Sides Double
ECC Support No
CAS Latency 5
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 67.6
PCB changed 200
Lead Shape No Lead
Part Status LTB
Pin Count 200
Organization 256Mx64
PLL No
Self Refresh No
Module Type 200SODIMM
RoHS Status Yes with exemptions
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TS256MSQ64V6U Documents

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