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TS32MSD64V3F5 Tech Specifications

Category Memory Cards
Manufacturer Transcend
ECCN (US) EAR99
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 333
Chip Configuration 32Mx8
Chip Package Type TSOP-II
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 2.7
Module Sides Double
ECC Support No
CAS Latency 2.5
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
Package Height 31.75
Package Length 67.6
PCB changed 200
Lead Shape No Lead
Part Status Active
Pin Count 200
Organization 32Mx64
PLL No
Self Refresh Yes
Module Type 200USODIMM
RoHS Status RoHS Compliant
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TS32MSD64V3F5 Documents

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