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TS8D30AR00LNS Tech Specifications

Category Memory Cards
Manufacturer Transcend
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 1320
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
ECC Support No
Number of Ranks DualRank
Supplier Package UDIMM
Mounting Socket
Package Height 30
Package Length 133.35
PCB changed 240
Maximum Clock Rate 1600(MHz)
Operating Temperature (Max.) 85C
Total Density 8GByte(b)
Operating Temperature Classification Commercial
Package Type UDIMM
Operating Temp Range 0C to 85C
Device Core Size 64(b)
Operating Supply Voltage (Max) 1.575(V)
Operating Supply Voltage (Typ) 1.5(V)
Rad Hardened No
Operating Supply Voltage (Min) 1.425(V)
Operating Temperature (Min.) 0C
Main Category DRAM Module
Packaging Bulk
Part Status Active
Pin Count 240
Organization 1Gx64
Module Type 240UDIMM
RoHS Status RoHS Compliant
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TS8D30AR00LNS Documents

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