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WS57C51B-55TMB Tech Specifications

Category Memory
Manufacturer STMicroelectronics
Surface Mount NO
Number of Terminals 28Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC
Access Time-Max 55 ns
Number of Words 16384 wordsWord
Supply Voltage-Nom (Vsup) 5 V
Package Style IN-LINE
Package Shape RECTANGULAR
Package Equivalence Code DIP28,.3
Package Code DIP
Package Body Material CERAMIC
Operating Temperature-Min -55 °C
Operating Temperature-Max 125 °C
Number of Words Code 16000Words Codes
JESD-609 Code e0
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.61
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-XDIP-T28
Qualification Status Not Qualified
Temperature Grade MILITARY
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.095 mA
Organization 16KX8
Output Characteristics 3-STATE
Memory Width 8
Standby Current-Max 0.035 A
Memory Density 131072 bit
Screening Level 38535Q/M;38534H;883B
Parallel/Serial PARALLEL
Memory IC Type UVPROM
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