Wakefield-Vette 655-53AB Heat Sinks
2.00°C/W @ 400 LFM
IN STOCK
Min. : 1
Mult. : 1
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655-53AB Tech Specifications
| Category | Thermal - Heat Sinks | |
| Manufacturer | Wakefield | |
| Factory Lead Time | 12 Weeks | |
| Mount | Adhesive | |
| Package / Case | BGA | |
| Material | Aluminum | |
| Shape | Square, Pin Fins | |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | |
| Material Finish | Black Anodized | |
| Series | 655 | |
| Published | 2008 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Top Mount | |
| Color | Black | |
| Attachment Method | Thermal Tape, Adhesive (Not Included) | |
| Height Off Base (Height of Fin) | 0.522 13.27mm | |
| Thermal Resistance @ Forced Air Flow | 2.00°C/W @ 400 LFM | |
| Natural Thermal Resistance | 2 °C/W | |
| Profile | PIN FIN ARRAY | |
| Power Dissipation @ Temperature Rise | 4.0W @ 40°C | |
| Fin Orientation | OMNIDIRECT | |
| Height | 13.3mm | |
| Length | 1.600 40.64mm | |
| Width | 1.600 40.64mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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655-53AB Documents
Download datasheets and manufacturer documentation for 655-53AB
- Mfg CAD Models655-53AB.stp
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