W29GL128CH9C Tech Specifications

Category Memory
Manufacturer Winbond
Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 56-TFBGA
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 0.8mm
JESD-30 Code R-PBGA-B56
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 128Mb 16M x 8 8M x 16
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 8MX16
Memory Width 16
Write Cycle Time - Word, Page 90ns
Standby Current-Max 0.000005A
Memory Density 134217728 bit
Access Time (Max) 90 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 128Sectors/Sizes
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Length 9mm
Height Seated (Max) 1.2mm
Width 7mm
RoHS Status ROHS3 Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

W29GL128CH9C Documents

Download datasheets and manufacturer documentation for   W29GL128CH9C

W29GL128CH9C brand manufacturers: Winbond Electronics, Elecinsight stock, W29GL128CH9C reference price.Winbond Electronics. W29GL128CH9C parameters, W29GL128CH9C Datasheet PDF and pin diagram description download.You can use the W29GL128CH9C Memory, DSP Datesheet PDF, find W29GL128CH9C pin diagram and circuit diagram and usage method of function,W29GL128CH9C electronics tutorials.You can download from the Elecinsight.