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W83910F Tech Specifications

Category Embedded - Microcontroller, Microprocessor, FPGA Modules
Manufacturer Winbond
Surface Mount YES
Number of Terminals 128Terminals
Supply Voltage-Nom 5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Max 5.5 V
Package Style FLATPACK, FINE PITCH
Package Shape RECTANGULAR
Package Equivalence Code QFP128,.67X.93,20
Package Code FQFP
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 70 °C
Number of I/O Lines 38I/O Lines
Clock Frequency-Max 40 MHz
Package Description FQFP, QFP128,.67X.93,20
Part Package Code QFP
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Life Cycle Code Obsolete
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Pin Count 128
JESD-30 Code R-PQFP-G128
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Seated Height-Max 3.32 mm
Address Bus Width 4
Boundary Scan NO
External Data Bus Width 4
RAM (words) 242
Bus Compatibility LPC
Width 14 mm
Length 20 mm
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W83910F Documents

Download datasheets and manufacturer documentation for   W83910F

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