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W25N01GWTCIG/TRAY Tech Specifications

Category USB Flash Drives
Manufacturer Winbond
EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Automotive No
PPAP No
Cell Type NAND
Chip Density (bit) 1G
Block Organization Symmetrical
Address Bus Width (bit) 32
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 128MWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 8
Maximum Erase Time (S) 0.01/Block
Maximum Programming Time (ms) 0.7/Page
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.95
Programming Voltage (V) 1.7 to 1.95
Operating Current (mA) 35
Program Current (mA) 35
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support Yes
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 0.85(Max)
Package Width 6
Package Length 8
PCB changed 24
Standard Package Name BGA
Supplier Package TFBGA
Lead Shape Ball
Packaging Tray
Part Status Active
Pin Count 24
Architecture Sectored
Sector Size 128Kbyte x 1024
Page Size 2Kbyte
Boot Block No
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