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- W25N02JWZEIC | High Performance QspiNAND Flash
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W25N02JWZEIC | High Performance QspiNAND Flash Tech Specifications
| Category | USB Flash Drives | |
| Manufacturer | Winbond | |
| EU RoHS | Compliant | |
| ECCN (US) | 3A991.b.1.a | |
| Automotive | No | |
| PPAP | No | |
| Cell Type | SLC NAND | |
| Chip Density (bit) | 2G | |
| Address Bus Width (bit) | 32 | |
| Number of Bits/Word (bit) | 8Bits/Word (bit)s | |
| Number of Words | 256MWord | |
| Programmability | Yes | |
| Timing Type | Synchronous | |
| Max. Access Time (ns) | 6 | |
| Maximum Erase Time (S) | 0.01/Block | |
| Maximum Programming Time (ms) | 0.7 | |
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) | |
| Minimum Operating Supply Voltage (V) | 1.7 | |
| Typical Operating Supply Voltage (V) | 1.8 | |
| Maximum Operating Supply Voltage (V) | 1.95 |
| Programming Voltage (V) | 1.7 to 1.95 | |
| Operating Current (mA) | 35 | |
| Program Current (mA) | 35 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Operating Temperature (°C) | 85 | |
| Supplier Temperature Grade | Industrial | |
| Command Compatible | Yes | |
| ECC Support | No | |
| Support of Page Mode | No | |
| Mounting | Surface Mount | |
| Package Height | 0.73 | |
| Package Width | 8 | |
| Package Length | 6 | |
| PCB changed | 8 | |
| Supplier Package | WSON EP | |
| Packaging | Tray | |
| Part Status | Active | |
| Pin Count | 8 | |
| Page Size | 2Kbyte | |
| Boot Block | No |
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