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Winbond Electronics Corporation W25N512GWBIR TR Memory ICs
Reel 104 MHz FLASH
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W25N512GWBIR TR Tech Specifications
| Category | Memory | |
| Manufacturer | Winbond | |
| Package / Case | TFBGA-24 | |
| Mounting Type | Surface Mount | |
| Supplier Device Package | 24-TFBGA (6x8) | |
| RoHS | Details | |
| Mounting Styles | SMD/SMT | |
| Interface Type | SPI | |
| Supply Voltage-Min | 1.7 V | |
| Minimum Operating Temperature | - 40 C | |
| Maximum Operating Temperature | + 85 C | |
| Factory Pack QuantityFactory Pack Quantity | 2000 | |
| Tradename | SpiStack | |
| Supply Voltage-Nom (Vsup) | 1.70V - 1.95V | |
| Supply Voltage-Max | 1.95 V | |
| Package | Tape & Reel (TR) | |
| Base Product Number | W25N512 | |
| Mfr | Winbond Electronics | |
| Product Status | Active |
| Memory Types | Non-Volatile | |
| Series | W25N512GW | |
| Packaging | Reel | |
| Operating Temperature | -40°C ~ 85°C (TA) | |
| Type | QspiNAND Flash | |
| Technology | FLASH - NAND (SLC) | |
| Voltage - Supply | 1.7V ~ 1.95V | |
| Memory Size | 512 Mbit | |
| Speed | 104MHz | |
| Clock Frequency | 104 MHz | |
| Access Time | 7 ns | |
| Memory Format | FLASH | |
| Memory Interface | SPI - Quad I/O | |
| Organization | High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width | |
| Write Cycle Time - Word, Page | 700µs | |
| Memory Density | 512Mb | |
| Temperature | 40ºC ~ 85ºC / -40ºC ~ 105ºC | |
| Memory Organization | 64M x 8 |
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