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W25Q32JVXGIM Tech Specifications

Category USB Flash Drives
Manufacturer Winbond
EU RoHS Compliant
ECCN (US) 3A991.b.1.a
HTS 8542.32.00.71
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 32M
Block Organization Symmetrical
Location of Boot Block Top|Bottom
Address Bus Width (bit) 24
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 4MWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 6
Maximum Erase Time (S) 50/Chip
Maximum Programming Time (ms) 3/Page
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3|3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 25
Program Current (mA) 25
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 0.43
Package Width 4
Package Length 4
PCB changed 8
Supplier Package XSON EP
Packaging Tube
Part Status Active
Pin Count 8
Architecture Sectored
Sector Size 4Kbyte x 1024
Page Size 256byte
Boot Block Yes
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