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W29N04GVSIAF TR Tech Specifications

Category USB Flash Drives
Manufacturer Winbond
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Supplier Device Package 48-TSOP
EU RoHS Compliant
ECCN (US) 3A991.b.1.a
HTS 8542.32.00.71
Automotive Yes
PPAP Unknown
Cell Type SLC NAND
Chip Density (bit) 4G
Block Organization Symmetrical
Address Bus Width (bit) 30
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 512MWord
Programmability Yes
Timing Type Asynchronous
Maximum Erase Time (S) 0.01/Block
Maximum Programming Time (ms) 0.7/Page
Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 35
Program Current (mA) 35
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible No
ECC Support Yes
Support of Page Mode No
Mounting Surface Mount
Package Height 1
Package Width 18.4
Package Length 12
PCB changed 48
Supplier Package TSOP
Package Tape & Reel (TR)
Mfr Winbond Electronics
Product Status Active
Memory Types Non-Volatile
Supply Voltage-Nom (Vsup) 2.7V - 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Series -
Part Status Active
Type SLC NAND Flash
Technology FLASH - NAND (SLC)
Voltage - Supply 2.7V ~ 3.6V
Pin Count 48
Memory Size 4Gbit
Speed 40MHz
Access Time 25 ns
Memory Format FLASH
Memory Interface ONFI
Architecture Sectored
Organization High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set
Write Cycle Time - Word, Page 25ns, 700µs
Memory Density 4Gb
Sector Size 128Kbyte x 4096
Page Size 2Kbyte
Boot Block No
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Memory Organization 512M x 8
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