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Winbond Electronics Corporation W9812G2IB-6/TRAY Memory ICs
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W9812G2IB-6/TRAY Tech Specifications
| Category | Memory | |
| Manufacturer | Winbond | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | SDRAM | |
| Chip Density (bit) | 128M | |
| Number of Internal Banks | 4Internal Banks | |
| Number of Words per Bank | 1M | |
| Number of Bits/Word (bit) | 32Bits/Word (bit)s | |
| Data Bus Width (bit) | 32 | |
| Maximum Clock Rate (MHz) | 166 | |
| Maximum Access Time (ns) | 6|5 | |
| Address Bus Width (bit) | 14 | |
| Interface Type | LVTTL | |
| Minimum Operating Supply Voltage (V) | 3 | |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 | |
| Operating Current (mA) | 200 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 70 | |
| Supplier Temperature Grade | Commercial | |
| Number of I/O Lines (bit) | 32I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Height | 0.8(Max) | |
| Package Width | 8 | |
| Package Length | 13 | |
| PCB changed | 90 | |
| Standard Package Name | BGA | |
| Supplier Package | TFBGA | |
| Lead Shape | Ball | |
| Part Status | Obsolete | |
| Pin Count | 90 | |
| Organization | 4Mx32 |
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