XCV600-4BGG560I Tech Specifications

Category Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Manufacturer Xilinx
Surface Mount YES
Number of Terminals 560Terminals
Manufacturer Part Number XCV600-4BGG560I
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Risk Rank 5.79
Clock Frequency-Max 250 MHz
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Supply Voltage-Max 2.625 V
Supply Voltage-Nom 2.5 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 2.375 V
JESD-609 Code e1
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Pin Count 560
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
Organization 3456 CLBS, 661111 GATES
Seated Height-Max 1.7 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max 0.8 ns
Number of CLBs 3456CLBs
Number of Equivalent Gates 661111Equivalent Gates
Length 42.5 mm
Width 42.5 mm
Select at least one checkbox above to show similar products in this category.
View Similar
XCV600-4BGG560I brand manufacturers: Xilinx, Elecinsight stock, XCV600-4BGG560I reference price.Xilinx. XCV600-4BGG560I parameters, XCV600-4BGG560I Datasheet PDF and pin diagram description download.You can use the XCV600-4BGG560I Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD), DSP Datesheet PDF, find XCV600-4BGG560I pin diagram and circuit diagram and usage method of function,XCV600-4BGG560I electronics tutorials.You can download from the Elecinsight.