Xilinx Inc. XC17S100APD8C Configuration Proms for FPGAs
8Pins 8Terminations
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XC17S100APD8C Tech Specifications
| Category | Memory - Configuration Proms for FPGAs | |
| Manufacturer | Xilinx | |
| Mounting Type | Through Hole | |
| Package / Case | 8-DIP (0.300, 7.62mm) | |
| Surface Mount | NO | |
| Number of Pins | 8Pins | |
| Operating Temperature | 0°C~70°C | |
| Packaging | Tube | |
| Published | 1999 | |
| JESD-609 Code | e0 | |
| Pbfree Code | no | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | Not Applicable | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Voltage - Supply | 3V~3.6V | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC17S100A | |
| Pin Count | 8 | |
| Operating Supply Voltage | 3.3V | |
| Supply Voltage-Max (Vsup) | 3.6V | |
| Supply Voltage-Min (Vsup) | 3V | |
| Programmable Type | OTP | |
| Output Characteristics | 3-STATE | |
| Memory Width | 1 | |
| Density | 1 Mb | |
| Standby Current-Max | 0.001A | |
| Parallel/Serial | SERIAL | |
| I/O Type | COMMON | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Length | 9.3599mm | |
| Height Seated (Max) | 4.5974mm | |
| Width | 7.62mm | |
| Radiation Hardening | No | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
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XC17S100APD8C Documents
Download datasheets and manufacturer documentation for XC17S100APD8C
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