XC18V512SOG20C Tech Specifications

Category Memory - Configuration Proms for FPGAs
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Number of Pins 20Pins
Operating Temperature 0°C~70°C
Packaging Tray
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC18V512
Pin Count 20
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type In System Programmable
Clock Frequency 33MHz
Organization 64KX8
Memory Width 8
Density 512 kb
Standby Current-Max 0.01A
Access Time (Max) 15 ns
Parallel/Serial PARALLEL/SERIAL
Memory IC Type CONFIGURATION MEMORY
Data Retention Time-Min 20
Length 12.827mm
Height Seated (Max) 2.6416mm
Width 7.5184mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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