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XC2C256-7FTG256C Tech Specifications

Category Embedded - CPLDs (Complex Programmable Logic Devices)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of I/Os 184I/Os
Operating Temperature 0°C~70°C TA
Packaging Tray
Series CoolRunner II
Published 2001
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Termination SMD/SMT
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 1mm
Frequency 256MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC2C256
Pin Count 256
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Programmable Type In System Programmable
Max Supply Voltage 1.9V
Min Supply Voltage 1.7V
Propagation Delay 5.7 ns
Number of Logic Elements/Cells 16Logic Elements/Cells
Number of Gates 6000Gates
Speed Grade 7
Output Function MACROCELL
Number of Macro Cells 256Macro Cells
JTAG BST YES
Voltage Supply - Internal 1.7V~1.9V
Delay Time tpd(1) Max 6.7ns
Height Seated (Max) 1.55mm
REACH SVHC Unknown
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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XC2C256-7FTG256C Documents

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