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XC2S200-6FG456C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 456-BBGA
Number of Pins 456Pins
Number of I/Os 284I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-II
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 456Terminations
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC2S200
Pin Count 456
Number of Outputs 284Outputs
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
RAM Size 7kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 5292Logic Elements/Cells
Total RAM Bits 57344
Number of Gates 200000Gates
Number of LABs/CLBs 1176LABs/CLBs
Speed Grade 6
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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XC2S200-6FG456C Documents

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