XC2S50-5FG256C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256Pins
Number of I/Os 176I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-II
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC2S50
Pin Count 256
Number of Outputs 176Outputs
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
RAM Size 4kB
Clock Frequency 263MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1728Logic Elements/Cells
Total RAM Bits 32768
Number of Gates 50000Gates
Number of LABs/CLBs 384LABs/CLBs
Speed Grade 5
Combinatorial Delay of a CLB-Max 0.7 ns
Number of CLBs 384CLBs
Length 17mm
Height Seated (Max) 2mm
Width 17mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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