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XC3S1000-4FTG256I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Number of I/Os 173I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Spartan®-3
Published 2004
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code EAR99
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S1000
Pin Count 256
Number of Outputs 173Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.32.5V
RAM Size 54kB
Clock Frequency 630MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 17280Logic Elements/Cells
Total RAM Bits 442368
Number of Gates 1000000Gates
Number of LABs/CLBs 1920LABs/CLBs
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.61 ns
Height 1mm
Length 17mm
Width 17mm
RoHS Status ROHS3 Compliant
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XC3S1000-4FTG256I Documents

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