XC3S1200E-4FG320I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 320-BGA
Number of Pins 320Pins
Number of I/Os 250I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Spartan®-3E
Published 2012
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 320Terminations
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn/Pb)
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S1200E
Pin Count 320
Number of Outputs 194Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.32.5V
RAM Size 63kB
Clock Frequency 572MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 19512Logic Elements/Cells
Total RAM Bits 516096
Number of Gates 1200000Gates
Number of LABs/CLBs 2168LABs/CLBs
Speed Grade 4
Number of Registers 17344Registers
Combinatorial Delay of a CLB-Max 0.76 ns
Length 19mm
Height Seated (Max) 2mm
Width 19mm
RoHS Status Non-RoHS Compliant
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