XC3S1400AN-4FGG676C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676Pins
Number of I/Os 502I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-3AN
Published 1999
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676Terminations
Termination SMD/SMT
ECCN Code 3A991.D
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 250MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S1400AN
Pin Count 676
Number of Outputs 408Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.33.3V
RAM Size 72kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 25344Logic Elements/Cells
Total RAM Bits 589824
Number of Gates 1400000Gates
Number of LABs/CLBs 2816LABs/CLBs
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.71 ns
Length 27mm
Width 27mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
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