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XC3S200-4TQG144C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 144-LQFP
Number of Pins 144Pins
Supplier Device Package 144-TQFP (20x20)
Number of I/Os 97I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-3
Published 2006
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 1.14V~1.26V
Base Part Number XC3S200
Operating Supply Voltage 1.2V
Max Supply Voltage 1.26V
Min Supply Voltage 1.14V
RAM Size 27kB
Number of Logic Elements/Cells 4320Logic Elements/Cells
Total RAM Bits 221184
Number of Gates 200000Gates
Number of LABs/CLBs 480LABs/CLBs
Number of Logic Blocks (LABs) 480Logic Blocks (LABs)s
Speed Grade 4
Height 1.4mm
Length 20mm
Width 20mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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XC3S200-4TQG144C Documents

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