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- XC3S50AN-4TQG144I
Xilinx Inc. XC3S50AN-4TQG144I Embedded FPGAs
50000Gates FIELD PROGRAMMABLE GATE ARRAY 101Outputs
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XC3S50AN-4TQG144I Tech Specifications
| Category | Embedded - FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Xilinx | |
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 144-LQFP | |
| Number of Pins | 144Pins | |
| Number of I/Os | 108I/Os | |
| Operating Temperature | -40°C~100°C TJ | |
| Packaging | Tray | |
| Series | Spartan®-3AN | |
| Published | 2007 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 144Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| Voltage - Supply | 1.14V~1.26V | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V | |
| Terminal Pitch | 0.5mm | |
| Frequency | 667MHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC3S50AN | |
| Pin Count | 144 | |
| Number of Outputs | 101Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.2V | |
| Power Supplies | 1.21.2/3.33.3V | |
| RAM Size | 6.8kB | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 1584Logic Elements/Cells | |
| Total RAM Bits | 55296 | |
| Number of Gates | 50000Gates | |
| Number of LABs/CLBs | 176LABs/CLBs | |
| Speed Grade | 4 | |
| Combinatorial Delay of a CLB-Max | 0.71 ns | |
| Number of CLBs | 176CLBs | |
| Height | 1.45mm | |
| Length | 20mm | |
| Width | 20mm | |
| REACH SVHC | Unknown | |
| RoHS Status | ROHS3 Compliant |
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XC3S50AN-4TQG144I Documents
Download datasheets and manufacturer documentation for XC3S50AN-4TQG144I
- DatasheetsSpartan-3AN FPGA Datasheet Extended Spartan-3A Family Overview Spartan-3AN Brochure
- PCN Design/SpecificationShipping Tray TQ144 and TQG144 12/Aug/2013
- PCN Assembly/OriginMult Dev LeadFrame Chg 29/Oct/2018
- PCN OtherWafer Fab Transfer/Copper Wire 05/May/2014
- Environmental InformationXilinx RoHS3
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