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XC3S700A-4FTG256C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Number of I/Os 161I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-3A
Published 1999
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code EAR99
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S700A
Pin Count 256
Number of Outputs 148Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.33.3V
RAM Size 45kB
Clock Frequency 667MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 13248Logic Elements/Cells
Total RAM Bits 368640
Number of Gates 700000Gates
Number of LABs/CLBs 1472LABs/CLBs
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.71 ns
Height 1mm
Length 17mm
Width 17mm
REACH SVHC Unknown
RoHS Status ROHS3 Compliant
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XC3S700A-4FTG256C Documents

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