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XC3SD1800A-5FGG676C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676Pins
Number of I/Os 519I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-3A DSP
Published 2008
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676Terminations
ECCN Code 3A991.D
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3SD1800A
Pin Count 676
Number of Outputs 409Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
RAM Size 189kB
Clock Frequency 280MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 37440Logic Elements/Cells
Total RAM Bits 1548288
Number of Gates 1800000Gates
Number of LABs/CLBs 4160LABs/CLBs
Speed Grade 5
Length 27mm
Height Seated (Max) 2.6mm
Width 27mm
RoHS Status ROHS3 Compliant
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XC3SD1800A-5FGG676C Documents

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