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XC3SD3400A-4FGG676I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676Pins
Number of I/Os 469I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Spartan®-3A DSP
Published 2008
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676Terminations
ECCN Code 3A991.D
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3SD3400A
Pin Count 676
Number of Outputs 409Outputs
Qualification Status Not Qualified
Power Supplies 1.22.5/3.3V
RAM Size 283.5kB
Clock Frequency 250MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 53712Logic Elements/Cells
Total RAM Bits 2322432
Number of Gates 3400000Gates
Number of LABs/CLBs 5968LABs/CLBs
Speed Grade 4
Length 27mm
Height Seated (Max) 2.6mm
Width 27mm
REACH SVHC Unknown
RoHS Status ROHS3 Compliant
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XC3SD3400A-4FGG676I Documents

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