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XC6SLX25-3FTG256I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Package / Case 256-LBGA
Mounting Type Surface Mount
Mount Surface Mount
Number of Pins 256Pins
Supplier Device Package 256-FTBGA (17x17)
Number of I/Os 186I/Os
Published 2008
Series Spartan®-6 LX
Packaging Tray
Operating Temperature -40°C~100°C TJ
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Voltage - Supply 1.14V~1.26V
Base Part Number XC6SLX25
Operating Supply Voltage 1.2V
RAM Size 117kB
Number of Logic Elements/Cells 24051Logic Elements/Cells
Total RAM Bits 958464
Number of LABs/CLBs 1879LABs/CLBs
Number of Logic Blocks (LABs) 1879Logic Blocks (LABs)s
Speed Grade 3
Number of Registers 30064Registers
RoHS Status ROHS3 Compliant
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XC6SLX25-3FTG256I Documents

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