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XC6SLX75T-3FGG676C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676Pins
Number of I/Os 348I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-6 LXT
Published 2008
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676Terminations
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC6SLX75
Pin Count 676
Number of Outputs 320Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
RAM Size 387kB
Clock Frequency 862MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 74637Logic Elements/Cells
Total RAM Bits 3170304
Number of LABs/CLBs 5831LABs/CLBs
Speed Grade 3
Number of Registers 93296Registers
Combinatorial Delay of a CLB-Max 0.21 ns
Length 27mm
Height Seated (Max) 2.44mm
Width 27mm
RoHS Status ROHS3 Compliant
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XC6SLX75T-3FGG676C Documents

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