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XC6VLX75T-1FFG784C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 784-BBGA, FCBGA
Number of Pins 784Pins
Number of I/Os 360I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Virtex®-6 LXT
Published 2008
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784Terminations
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Voltage - Supply 0.95V~1.05V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC6VLX75T
Pin Count 784
Number of Outputs 360Outputs
Qualification Status Not Qualified
RAM Size 702kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 74496Logic Elements/Cells
Total RAM Bits 5750784
Number of LABs/CLBs 5820LABs/CLBs
Speed Grade 1
Combinatorial Delay of a CLB-Max 5.08 ns
Length 29mm
Width 29mm
REACH SVHC Unknown
RoHS Status ROHS3 Compliant
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XC6VLX75T-1FFG784C Documents

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