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XC7K325T-1FBG900C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 11 Weeks
Contact Plating Copper, Silver, Tin
Mounting Type Surface Mount
Package / Case 900-BBGA, FCBGA
Number of Pins 900Pins
Supplier Device Package 900-FCBGA (31x31)
Memory Types DDR3
Number of I/Os 500I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Kintex®-7
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 0.97V~1.03V
Base Part Number XC7K325T
Max Supply Voltage 1.03V
Min Supply Voltage 970mV
Memory Size 1GB
RAM Size 2MB
Number of Logic Elements/Cells 326080Logic Elements/Cells
Total RAM Bits 16404480
Number of LABs/CLBs 25475LABs/CLBs
Number of Logic Blocks (LABs) 25475Logic Blocks (LABs)s
Speed Grade -1
Number of Registers 407600Registers
RoHS Status ROHS3 Compliant
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XC7K325T-1FBG900C Documents

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