XC7K70T-2FBG676I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676Pins
Number of I/Os 300I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Kintex®-7
Published 2010
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676Terminations
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Voltage - Supply 0.97V~1.03V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number XC7K70T
Pin Count 676
Number of Outputs 300Outputs
Qualification Status Not Qualified
Power Supplies 11.83.3V
RAM Size 607.5kB
Clock Frequency 1286MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 65600Logic Elements/Cells
Total RAM Bits 4976640
Number of LABs/CLBs 5125LABs/CLBs
Speed Grade -2
Number of Registers 82000Registers
Combinatorial Delay of a CLB-Max 0.61 ns
Length 27mm
Height Seated (Max) 2.54mm
Width 27mm
RoHS Status ROHS3 Compliant
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