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- XC7K70T-3FBG676E
Xilinx Inc. XC7K70T-3FBG676E Embedded FPGAs
FIELD PROGRAMMABLE GATE ARRAY 300Outputs
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XC7K70T-3FBG676E Tech Specifications
| Category | Embedded - FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Xilinx | |
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Copper, Silver, Tin | |
| Mounting Type | Surface Mount | |
| Package / Case | 676-BBGA, FCBGA | |
| Surface Mount | YES | |
| Number of Pins | 676Pins | |
| Number of I/Os | 300I/Os | |
| Operating Temperature | 0°C~100°C TJ | |
| Packaging | Tray | |
| Series | Kintex®-7 | |
| Published | 2010 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Number of Terminations | 676Terminations | |
| ECCN Code | 3A991.D | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 0.97V~1.03V | |
| Terminal Position | BOTTOM |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Supply Voltage | 1V | |
| Terminal Pitch | 1mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Base Part Number | XC7K70T | |
| Pin Count | 676 | |
| Number of Outputs | 300Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 11.83.3V | |
| RAM Size | 607.5kB | |
| Clock Frequency | 1412MHz | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 65600Logic Elements/Cells | |
| Total RAM Bits | 4976640 | |
| Number of LABs/CLBs | 5125LABs/CLBs | |
| Speed Grade | -3 | |
| Number of Registers | 82000Registers | |
| Combinatorial Delay of a CLB-Max | 0.58 ns | |
| Length | 27mm | |
| Height Seated (Max) | 2.54mm | |
| Width | 27mm | |
| RoHS Status | ROHS3 Compliant |
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XC7K70T-3FBG676E Documents
Download datasheets and manufacturer documentation for XC7K70T-3FBG676E
- DatasheetsKintex-7 FPGAs Datasheet 7 Series FPGA Overview
- PCN Design/SpecificationMult Dev Material Chg 16/Dec/2019 Cross-Ship Lead-Free Notice 31/Oct/2016 Zynq-7000 Datasheet Update 02/Jun/2014
- PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
- Environmental InformationXilinx RoHS3
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