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XC7Z007S-2CLG400I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Package / Case 400-LFBGA, CSPBGA
Surface Mount YES
Number of I/Os 100I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2016
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400Terminations
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Speed 766MHz
RAM Size 256KB
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Clock Frequency 800MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 23K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Length 17mm
Height Seated (Max) 1.6mm
Width 17mm
RoHS Status ROHS3 Compliant
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