XC7Z020-1CLG484C Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 484-LFBGA, CSPBGA
Surface Mount YES
Number of Pins 2Pins
Number of I/Os 130I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Zynq®-7000
Published 2009
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484Terminations
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z020
JESD-30 Code S-PBGA-B484
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 3.3V
Min Supply Voltage 1.2V
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
Primary Attributes Artix™-7 FPGA, 85K Logic Cells
Length 19mm
Height Seated (Max) 1.6mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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