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XC7Z030-1FF676I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 11 Weeks
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of I/Os 4I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676Terminations
Additional Feature GPIO WITH FOUR 32-BIT BANKS
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
JESD-30 Code S-PBGA-B676
Speed 667MHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Clock Frequency 667MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN, ETHERNET, I2C, PCI, SPI, UART, USB
RoHS Status Non-RoHS Compliant
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