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- XC7Z030-2FFG676I
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XC7Z030-2FFG676I Tech Specifications
Category | Embedded - System On Chip (SoC) | |
Manufacturer | Xilinx | |
Factory Lead Time | 10 Weeks | |
Contact Plating | Copper, Silver, Tin | |
Package / Case | 676-BBGA, FCBGA | |
Surface Mount | YES | |
Number of Pins | 676Pins | |
Number of I/Os | 130I/Os | |
Operating Temperature | -40°C~100°C TJ | |
Packaging | Tray | |
Series | Zynq®-7000 | |
Published | 2009 | |
JESD-609 Code | e1 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
Number of Terminations | 676Terminations | |
ECCN Code | 3A991.D | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
HTS Code | 8542.39.00.01 | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | 245 | |
Supply Voltage | 1V | |
Terminal Pitch | 1mm |
Frequency | 800MHz | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Base Part Number | XC7Z030 | |
Pin Count | 676 | |
Operating Supply Voltage | 1V | |
Supply Voltage-Max (Vsup) | 1.05V | |
Power Supplies | 11.8V | |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | |
RAM Size | 256KB | |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
Peripherals | DMA | |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Architecture | MCU, FPGA | |
Data Bus Width | 32b | |
Core Architecture | ARM | |
Boundary Scan | YES | |
Speed Grade | -2 | |
RAM (words) | 256000 | |
Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells | |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB | |
UV Erasable | N | |
Length | 27mm | |
Height Seated (Max) | 3.24mm | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant |
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XC7Z030-2FFG676I Documents
Download datasheets and manufacturer documentation for XC7Z030-2FFG676I
- DatasheetsZynq-7000 All Programmable SoC Overview XC7Z030,35,45,100 Datasheet Zynq-7000 Errata Zynq-7000 User Guide
- Environmental InformationXilinx RoHS3
- PCN Design/SpecificationZynq-7000 AP Requirement 28/Sep/2015 Mult Dev Material Chg 16/Dec/2019
- PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
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