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XC7Z030-2SBG485I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-FBGA, FCBGA
Number of Pins 485Pins
Number of I/Os 130I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2009
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 485Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Length 19mm
Height Seated (Max) 2.44mm
RoHS Status ROHS3 Compliant
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