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XC7Z035-1FFG900C Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/Os 130I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 667MHz
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Speed 667MHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 120 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Speed Grade 1
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800Registers
RoHS Status ROHS3 Compliant
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XC7Z035-1FFG900C Documents

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