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XC7Z045-3FFV676E Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Package / Case 676-BBGA, FCBGA
Number of I/Os 130I/Os
Operating Temperature 0°C~100°C TJ
Packaging Bulk
Series Zynq®-7000
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Speed 1GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
RoHS Status ROHS3 Compliant
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