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XCCACEM64-BG388I Tech Specifications

Category Memory - Modules
Manufacturer Xilinx
Package / Case 388-BBGA
Surface Mount YES
Number of Pins 388Pins
Memory Types FLASH
Published 1999
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 388Terminations
Terminal Finish TIN LEAD
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Frequency 133MHz
Pin Count 388
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.83.3V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.71V
Memory Size 64MB
Organization 4MX16
Memory Width 16
Memory Density 67108864 bit
Parallel/Serial SERIAL
Endurance 1000000 Write/Erase Cycles
Length 35mm
Height Seated (Max) 2.87mm
Width 35mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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XCCACEM64-BG388I Documents

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