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XCF01SVO20C Tech Specifications

Category Memory - Configuration Proms for FPGAs
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Number of Pins 20Pins
Operating Temperature -40°C~85°C
Packaging Tray
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20Terminations
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCF*S
Pin Count 20
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33V
Supply Voltage-Min (Vsup) 3V
Programmable Type In System Programmable
Memory Size 1Mb
Organization 1MX1
Memory Width 1
Standby Current-Max 0.001A
Memory Density 1048576 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Data Retention Time-Min 20
Length 6.5024mm
Height Seated (Max) 1.19mm
Width 4.4mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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XCF01SVO20C Documents

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