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XCF04SVOG20C Tech Specifications

Category Memory - Configuration Proms for FPGAs
Manufacturer Xilinx
Factory Lead Time 13 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Number of Pins 20Pins
Memory Types FLASH
Operating Temperature -40°C~85°C
Packaging Tube
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCF*S
Pin Count 20
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type In System Programmable
Interface Parallel, Serial
Memory Size 4Mb
Clock Frequency 33MHz
Organization 4MX1
Standby Current-Max 0.001A
Memory Density 4194304 bit
Data Retention Time-Min 20
Height 1.04mm
Length 6.5mm
Width 4.39mm
REACH SVHC Unknown
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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XCF04SVOG20C Documents

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