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XCF08PFSG48C Tech Specifications

Category Memory - Configuration Proms for FPGAs
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-TFBGA, CSPBGA
Number of Pins 48Pins
Memory Types FLASH
Operating Temperature -40°C~85°C
Packaging Tray
Published 1999
JESD-609 Code e2
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
HTS Code 8542.32.00.51
Voltage - Supply 1.65V~2V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.8V
Frequency 50MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCF*P
Pin Count 48
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 2V
Supply Voltage-Min (Vsup) 1.65V
Programmable Type In System Programmable
Interface Parallel, Serial
Memory Size 8Mb
Organization 8MX1
Standby Current-Max 0.001A
Memory Density 8388608 bit
Endurance 20000 Write/Erase Cycles
Height 860μm
Length 9mm
Width 8mm
REACH SVHC Unknown
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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XCF08PFSG48C Documents

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