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XCF32PVOG48C Tech Specifications

Category Memory - Configuration Proms for FPGAs
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Number of Pins 48Pins
Operating Temperature -40°C~85°C
Packaging Tray
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
ECCN Code 3A991.B.1
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.61
Voltage - Supply 1.65V~2V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCF*P
Pin Count 48
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 2V
Supply Voltage-Min (Vsup) 1.65V
Programmable Type In System Programmable
Memory Size 32Mb
Organization 32MX1
Standby Current-Max 0.001A
Memory Density 33554432 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Endurance 20000 Write/Erase Cycles
Data Retention Time-Min 20
Height 1mm
Length 12.1mm
Width 18.5mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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XCF32PVOG48C Documents

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